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    • Home
    • Vision
    • Mission
    • TEC Technology
    • High/Low Temp Test Oven
    • ThermoStream
    • Test Contactor
    • Universal Load Board
    • Stiffener for Load Board
    • Change Kit
    • Circuit Board Repair
    • Contact Us
  • Home
  • Vision
  • Mission
  • TEC Technology
  • High/Low Temp Test Oven
  • ThermoStream
  • Test Contactor
  • Universal Load Board
  • Stiffener for Load Board
  • Change Kit
  • Circuit Board Repair
  • Contact Us
UDL Advance Technology Pte Ltd

UDL Advance Technology Pte Ltd

UDL Advance Technology Pte LtdUDL Advance Technology Pte Ltd

TEC - Thermoelectric Cooling

Thermoelectric Cooling

Thermoelectric cooling, often abbreviated as TEC, is a solid-state method of heat transfer based on the Peltier effect. 

It is used in systems where precise temperature control, compact design, or silent operation is required.

Thermal Chiller

Thermal Chiller

Air-cooled, easy setup and operation.

Weight: 35 KG

Nosie: 35 dB (International Standard)

No-load Temperature:  -30℃ ~ +10℃ 

Flow rate detection

Water level detection


Thermal Head

Thermal Head

TEC within the Thermal Head, for Hot/Cold application.

Inclusive of Cooling Device, Temperature Sensing Device and Pressure Device.

Available for customization from Package Outline Drawing.


Thermal Controller

Thermal Controller

Patented Design.

Using a closed-loop control mechanism for the precise temperature control.

Available for customization for the thermostat.

Software control via RS232 cable.


Drying Solution

Drying Solution

Dew Point:-40℃/-70℃ 

Create a dry and sealed environment to resolve the frost issue.

Supports customization, adapts to different scenarios, with design flexibility.


UDL Advance Technology Pte Ltd

Email: JeremyGoh@UDLAT.com

Mobile: +65 9235 8728

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