• Home
  • Vision
  • Mission
  • TEC Technology
  • High/Low Temp Test Oven
  • ThermoStream
  • Test Contactor
  • Universal Load Board
  • Stiffener for Load Board
  • Change Kit
  • Circuit Board Repair
  • Contact Us
  • More
    • Home
    • Vision
    • Mission
    • TEC Technology
    • High/Low Temp Test Oven
    • ThermoStream
    • Test Contactor
    • Universal Load Board
    • Stiffener for Load Board
    • Change Kit
    • Circuit Board Repair
    • Contact Us
  • Home
  • Vision
  • Mission
  • TEC Technology
  • High/Low Temp Test Oven
  • ThermoStream
  • Test Contactor
  • Universal Load Board
  • Stiffener for Load Board
  • Change Kit
  • Circuit Board Repair
  • Contact Us
UDL Advance Technology Pte Ltd

UDL Advance Technology Pte Ltd

UDL Advance Technology Pte LtdUDL Advance Technology Pte Ltd

ThermoStream

ThermoStream

Temperature Range：-65℃to +180℃ 

Rise/Fall Rate：-50℃to 125℃within 15 Sec 

Air Requirement：2.5-9 L/Sec，6.2-7.6 Bar

Dew Point within 10℃，Oil content 0.01ppm 

Power Supply：220V/26A 

Dimension:   910x600x1200mm 

UDL Advance Technology Pte Ltd

Email: JeremyGoh@UDLAT.com

Mobile: +65 9235 8728

Copyright © 2025 UDL Advance Technology Pte Ltd - All Rights Reserved.

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